Patent Assignment
Reel/Frame 026018/0574
Assignment of Assignor's Interest
Recorded: 2011-03-24
Pages: 5
Assignors
PAGAILA, REZA ARGENTY
Executed: 2011-03-07
PARK, SOO JUNG
Executed: 2011-03-07
CHI, HEEJO
Executed: 2011-03-07
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System Using B-Stage Polymer and Method of Manufacture Thereof
Application:
13/042,457 →
Publication:
US 2012/0228768
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Jun 28, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039186/0461 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →