Patent Assignment
Reel/Frame 039186/0461
Change of Name
Recorded: 2016-06-28
Pages: 2
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-30
Assignee
STATS CHIPPAC PTE. LTD.
10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System Using B-Stage Polymer and Method of Manufacture Thereof
Application:
13/042,457 →
Publication:
US 2012/0228768
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 24, 2011
From: PAGAILA, REZA ARGENTY; PARK, SOO JUNG; CHI, HEEJO
To: STATS CHIPPAC LTD.
Reel/Frame 026018/0574 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →