Patent Assignment
Reel/Frame 026018/0589
Assignment of Assignor's Interest
Recorded: 2011-03-24
Pages: 2
Assignors
HONDA, KAZUTAKA
Executed: 2010-07-15
ENOMOTO, TETSUYA
Executed: 2010-07-16
NAKAMURA, YUUKI
Executed: 2010-07-21
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Semiconductor-Encapsulating Adhesive, Semiconductor-Encapsulating Film-Form Adhesive, Method for Producing Semiconductor Device, and Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Jan 30, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 032141/0125 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →