Patent Assignment
Reel/Frame 032141/0125
Change of Address
Recorded: 2014-01-30
Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2014-01-30
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Semiconductor-Encapsulating Adhesive, Semiconductor-Encapsulating Film-Form Adhesive, Method for Producing Semiconductor Device, and Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 24, 2011
From: HONDA, KAZUTAKA; ENOMOTO, TETSUYA; NAKAMURA, YUUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 026018/0589 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →