Patent Assignment
Reel/Frame 026063/0863
Assignment of Assignor's Interest
Recorded: 2011-04-01
Pages: 4
Assignors
CAMACHO, ZIGMUND RAMIREZ
Executed: 2011-03-22
BATHAN, HENRY DESCALZO
Executed: 2011-03-22
ESPIRITU, EMMANUEL
Executed: 2011-03-22
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Leveling Standoff and Method of Manufacture Thereof
Application:
13/070,362 →
Publication:
US 2012/0241926
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →