INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an integrated circuit adjacent the lead; molding an encapsulation encapsulating the lead and the integrated circuit; and forming a leveling standoff protruded from the same surface of the encapsulation as the lead with the integrated circuit between the lead and the leveling standoff electrically isolated from the lead and the integrated circuit.
1 . A method of manufacture of an integrated circuit packaging system comprising:
providing a lead;
mounting an integrated circuit adjacent the lead;
molding an encapsulation encapsulating the lead and the integrated circuit; and
forming a leveling standoff protruded from the same surface of the encapsulation as the lead with the integrated circuit between the lead and the leveling standoff electrically isolated from the lead and the integrated circuit.
2 . The method as claimed in claim 1 wherein forming the leveling standoff includes forming the leveling standoff from a portion of the encapsulation.
3 . The method as claimed in claim 1 wherein forming the leveling standoff includes forming the leveling standoff from the lead.
4 . The method as claimed in claim 1 wherein mounting the integrated circuit includes connecting a bond wire to the lead and the integrated circuit.
5 . The method as claimed in claim 1 wherein forming the leveling standoff includes matching an offset height to the vertical difference between the bottom of the lead and the bottom of the encapsulation.
6 . A method of manufacture of an integrated circuit packaging system comprising:
providing a lead frame having a lead and an integrated circuit pad;
mounting an integrated circuit on the lead frame;
plating a system contact on the bottom of the lead frame;
attaching an integrated circuit to the integrated circuit pad with an adhesive;
connecting a bond wire to the lead and the integrated circuit;
molding an encapsulation encapsulating the lead frame, the adhesive, and the integrated circuit and exposing a bottom surface of the lead frame; and
forming a leveling standoff with a portion of the lead frame or the encapsulation, with the leveling standoff having a standoff-height protruded away from the bottom of the encapsulation and matching the vertical difference between the bottom of the lead, with the integrated circuit between the lead and the leveling standoff electrically isolated from the lead and the integrated circuit.
7 . The method as claimed in claim 6 further comprising attaching a coverlay tape to the bottom of the lead frame.
8 . The method as claimed in claim 6 wherein providing the lead includes partially etching a top surface of the lead frame.
9 . The method as claimed in claim 6 further comprising etching away the lead frame.
10 . The method as claimed in claim 6 wherein
providing the lead frame includes providing the lead frame having a hole;
molding the encapsulation includes extruding the encapsulation over the lead frame and through the hole in the lead frame; and
forming the leveling standoff includes setting the portion of the encapsulation extruded through the hole of the lead frame.
11 . An integrated circuit packaging system comprising:
a lead;
an integrated circuit mounted adjacent the lead;
an encapsulation encapsulating the lead and the integrated circuit; and
a leveling standoff protruded from the same surface of the encapsulation as the lead with the integrated circuit between the lead and the leveling standoff electrically isolated from the lead and the integrated circuit.
12 . The system as claimed in claim 11 wherein the leveling standoff is a portion of the encapsulation.
13 . The system as claimed in claim 11 wherein the leveling standoff is the lead electrically isolated from the integrated circuit.
14 . The system as claimed in claim 11 further comprising a bond wire connected to the integrated circuit and the lead.
15 . The system as claimed in claim 11 wherein the leveling standoff has an offset height matching the vertical difference between the bottom of the lead and the bottom of the encapsulation.
16 . The system as claimed in claim 11 further comprising:
a lead frame having the lead and an integrated circuit pad, and having a system contact on the bottom;
an adhesive attaching the integrated circuit to the integrated circuit pad;
a bond wire connecting the lead and the integrated circuit; and
wherein:
the encapsulation encapsulates the lead frame, the adhesive, and the integrated circuit and exposes a bottom surface of the lead frame;
the leveling standoff is formed from a portion of the lead frame or the encapsulation, with the leveling standoff having a standoff-height protruded away from the bottom of the encapsulation and matching the vertical difference between the bottom of the lead, with the integrated circuit between the lead and the leveling standoff electrically isolated from the lead and the integrated circuit.
17 . The system as claimed in claim 16 wherein the leveling standoff having the standoff height matching the vertical difference between the bottom of the lead and the bottom of the encapsulation is characteristic of attaching a coverlay tape to the bottom of the lead frame.
18 . The system as claimed in claim 16 wherein the lead frame is partially etched on a top surface.
19 . The system as claimed in claim 16 wherein the lead, the leveling standoff, or a combination thereof have a tapered shape exposed by the encapsulation, characteristic of etching away the lead frame.
20 . The system as claimed in claim 16 wherein:
the lead frame has a hole; and
the leveling standoff is a portion of the encapsulation set in the hole.