Patent Assignment
Reel/Frame 026152/0300
Assignment of Assignor's Interest
Recorded: 2011-04-19
Pages: 4
Assignors
ALVARADO, REYNANTE
Executed: 2008-09-02
LU, YUAN
Executed: 2008-09-04
REDBURN, RICHARD
Executed: 2008-08-29
Assignee
FLIPCHIP INTERNATIONAL, LLC
3701 EAST UNIVERSITY DRIVE, PHOENIX, ARIZONA, 85034
Covered Property
(1)
Solder Bump Interconnect for Improved Mechanical and Thermo-Mechanical Performance
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2008
From: ALVARADO, REYNANTE; LU, YUAN; REDBURN, RICHARD
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 021508/0538 →
Security Agreement
Nov 10, 2011
From: FLIPCHIP INTERNATIONAL, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 027212/0515 →
Release of Security Interest
Feb 17, 2021
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: FLIPCHIP INTERNATIONAL, LLC
Reel/Frame 055292/0898 →
Assignment of Assignor's Interest
Jun 17, 2021
From: FLIPCHIP INTERNATIONAL, LLC
To: HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
Reel/Frame 056612/0882 →