IP Library › Assignment 026261/0916
Patent Assignment
Reel/Frame 026261/0916

Assignment of Assignor's Interest

Recorded: 2011-05-11 Pages: 6
Assignor
SANDISK CORPORATION
Executed: 2011-04-04
Assignee
SANDISK TECHNOLOGIES INC.
6900 NORTH DALLAS PARKWAY, TWO LEGACY TOWN CENTER, PLANO, TEXAS, 75024
Covered Property (1)
Method of Fabricating a Semiconductor Die Having a Redistribution Layer
Patent: 7,772,047 →
Application: 11/769,927 →
Publication: US 2009/0004781
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 12, 2007
From: LIAO, CHIEN-KO; CHIU, CHIN-TIEN; CHIEN, JACK CHANG; YU, CHEEMEN
To: SANDISK CORPORATION
Reel/Frame 019819/0195 →
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038809/0600 →
Assignment of Assignor's Interest Nov 12, 2021
From: SANDISK TECHNOLOGIES LLC
To: WODEN TECHNOLOGIES INC.
Reel/Frame 058871/0928 →
Assignment of Assignor's Interest Jun 20, 2022
From: WODEN TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0902 →