IP Library Assignment 026289/0534
Patent Assignment
Reel/Frame 026289/0534

Assignment of Assignor's Interest

Recorded: 2011-05-17 Pages: 2
Assignor
YANG, WEN-KUN
Executed: 2011-04-07
Assignee
KING DRAGON INTERNATIONAL INC.
WICKHAMS CAY, P.O. BOX 662, ROAD TOWN, TORTOLA, VIRGIN ISLANDS, BRITISH
Covered Property (1)
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon via and Method of the Same
Patent: 8,106,504 →
Application: 12/385,358 →
Publication: US 2010/0072606
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 20, 2024
From: KING DRAGON INTERNATIONAL INC.
To: YANG, WEN-KUN
Reel/Frame 068342/0719 →
Assignment of Assignor's Interest Dec 1, 2024
From: YANG, WEN-KUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 069442/0676 →