IP Library › Assignment 069442/0676
Patent Assignment
Reel/Frame 069442/0676

Assignment of Assignor's Interest

Recorded: 2024-12-01 Pages: 3
Assignor
YANG, WEN-KUN
Executed: 2024-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Properties (11)
Substrate Structure with Die Embedded Inside and Dual Build-Up Layers Over Both Side Surfaces and Method of the Same
Patent: 8,237,257 →
Application: 12/232,847 →
Publication: US 2010/0072588
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon via and Method of the Same
Patent: 8,106,504 →
Application: 12/385,358 →
Publication: US 2010/0072606
Substrate Structure with Die Embedded Inside and Dual Build-Up Layers Over Both Side Surfaces and Method of the Same
Patent: 8,115,297 →
Application: 12/591,812 →
Publication: US 2010/0078655
Semiconductor Device Package Structure and Method for the Same
Patent: 8,350,377 →
Application: 12/855,705 →
Publication: US 2010/0301474
Led Chip
Patent: 8,299,488 →
Application: 12/970,194 →
Publication: US 2012/0153299
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon via and Method of the Same
Patent: 8,236,608 →
Application: 13/093,226 →
Publication: US 2011/0195546
Substrate Structure with Die Embedded Inside and Dual Build-Up Layers Over Both Side Surfaces and Method of the Same
Patent: 8,304,287 →
Application: 13/170,589 →
Publication: US 2011/0256714
Image Sensor Package with Dual Substrates and the Method of the Same
Patent: 8,232,633 →
Application: 13/289,864 →
Publication: US 2012/0043635
Semiconductor Device Package and Method of the Same
Patent: 9,379,081 →
Application: 14/223,157 →
Publication: US 2015/0270239
LED Package and Method of the Same
Patent: 9,117,941 →
Application: 14/485,370 →
Publication: US 2015/0004727
Method for Forming Semiconductor Device Package with Slanting Structures
Patent: 9,634,180 →
Application: 14/578,483 →
Publication: US 2015/0111327
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 12, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026111/0660 →
Assignment of Assignor's Interest Apr 25, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026175/0351 →
Assignment of Assignor's Interest May 17, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026296/0979 →
Assignment of Assignor's Interest May 17, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026289/0534 →
Assignment of Assignor's Interest May 19, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026308/0452 →
Assignment of Assignor's Interest Jul 7, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026552/0965 →
Assignment of Assignor's Interest Nov 4, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 027181/0590 →
Assignment of Assignor's Interest Mar 24, 2014
From: YANG, WEN KUN; YANG, YU-HSIANG
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 032509/0346 →
Assignment of Assignor's Interest Sep 12, 2014
From: YANG, WEN KUN; YANG, YU-HSIANG
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 033734/0606 →
Assignment of Assignor's Interest Dec 21, 2014
From: YANG, WEN KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 034562/0885 →
Assignment of Assignor's Interest Feb 24, 2020
From: KING DRAGON INTERNATIONAL INC.
To: YANG, CHING-LUNG
Reel/Frame 051909/0181 →
Assignment of Assignor's Interest Jun 10, 2021
From: KING DRAGON INTERNATIONAL INC.
To: YANG, CHING-LUNG
Reel/Frame 056503/0697 →
Assignment of Assignor's Interest Jan 11, 2024
From: YANG, CHING-LUNG
To: YANG, WEN-KUN
Reel/Frame 066099/0117 →
Assignment of Assignor's Interest Aug 20, 2024
From: KING DRAGON INTERNATIONAL INC.
To: YANG, WEN-KUN
Reel/Frame 068342/0719 →