Patent Assignment
Reel/Frame 026175/0351
Assignment of Assignor's Interest
Recorded: 2011-04-25
Pages: 2
Assignor
YANG, WEN-KUN
Executed: 2011-04-07
Assignee
KING DRAGON INTERNATIONAL INC.
WICKHAMS CAY, P.O. BOX 662, ROAD TOWN, TORTOLA, VIRGIN ISLANDS, BRITISH
Covered Property
(1)
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon via and Method of the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 10, 2021
From: KING DRAGON INTERNATIONAL INC.
To: YANG, CHING-LUNG
Reel/Frame 056503/0697 →
Assignment of Assignor's Interest
Jan 11, 2024
From: YANG, CHING-LUNG
To: YANG, WEN-KUN
Reel/Frame 066099/0117 →
Assignment of Assignor's Interest
Dec 1, 2024
From: YANG, WEN-KUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 069442/0676 →