Patent Assignment
Reel/Frame 056503/0697
Assignment of Assignor's Interest
Recorded: 2021-06-10
Pages: 10
Assignor
KING DRAGON INTERNATIONAL INC.
Executed: 2021-04-06
Assignee
YANG, CHING-LUNG
1272 SUNRISE WAY, MILPITAS, CALIFORNIA, 95035
Covered Properties
(4)
Substrate Structure with Die Embedded Inside and Dual Build-Up Layers Over Both Side Surfaces and Method of the Same
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon via and Method of the Same
Image Sensor Package with Dual Substrates and the Method of the Same
Semiconductor Device Package and Method of the Same
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 25, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026175/0351 →
Assignment of Assignor's Interest
May 19, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026308/0452 →
Assignment of Assignor's Interest
Nov 4, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 027181/0590 →
Assignment of Assignor's Interest
Mar 24, 2014
From: YANG, WEN KUN; YANG, YU-HSIANG
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 032509/0346 →
Assignment of Assignor's Interest
Jan 11, 2024
From: YANG, CHING-LUNG
To: YANG, WEN-KUN
Reel/Frame 066099/0117 →
Assignment of Assignor's Interest
Dec 1, 2024
From: YANG, WEN-KUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 069442/0676 →