Patent Assignment
Reel/Frame 068342/0719
Assignment of Assignor's Interest
Recorded: 2024-08-20
Pages: 5
Assignor
KING DRAGON INTERNATIONAL INC.
Executed: 2024-08-15
Assignee
YANG, WEN-KUN
NO.47, LANE 6, AN-KANG ST., HSIN-CHU CITY, TAIWAN
Covered Properties
(6)
Stacking Package Structure with Chip Embedded Inside and Die Having Through Silicon via and Method of the Same
Semiconductor Device Package Structure and Method for the Same
Led Chip
Substrate Structure with Die Embedded Inside and Dual Build-Up Layers Over Both Side Surfaces and Method of the Same
LED Package and Method of the Same
Method for Forming Semiconductor Device Package with Slanting Structures
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 12, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026111/0660 →
Assignment of Assignor's Interest
May 17, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026289/0534 →
Assignment of Assignor's Interest
May 17, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026296/0979 →
Assignment of Assignor's Interest
Sep 12, 2014
From: YANG, WEN KUN; YANG, YU-HSIANG
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 033734/0606 →
Assignment of Assignor's Interest
Dec 21, 2014
From: YANG, WEN KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 034562/0885 →
Assignment of Assignor's Interest
Dec 1, 2024
From: YANG, WEN-KUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 069442/0676 →