LED chip
The present invention provides a LED chip structure. The LED chip structure comprises a substrate and an N type layer disposed on the substrate; a P type layer disposed on the N type layer; a N type contact pad and a P type contact pad disposed below the substrate; conductive through holes disposed through the substrate to electrically connect the N type layer to the N type contact pad and the P type layer to the conduct heat generated by the P type layer and the N type layer downward.
1. A LED chip structure, comprising:
a substrate and a first type semiconductor layer disposed on said substrate;
a second type semiconductor layer disposed on said first type semiconductor layer;
a reflection layer directly formed on said second type semiconductor layer;
a passivation layer disposed on said reflection layer;
a first type semiconductor contact pad connected to said first type semiconductor layer, and a second type semiconductor contact pad connected to said second type semiconductor layer; and
a thermal pad disposed on said passivation layer to conduct heat generated by said first type semiconductor layer and said second type semiconductor layer, wherein said passivation layer electrically isolates said thermal pad from said reflection layer and said second type semiconductor layer.
2. The structure of claim 1 , wherein material of said substrate comprises glass or sapphire.
3. The structure of claim 1 , wherein material of said passivation layer comprises silicon dioxide or silicon nitride.
4. The structure of claim 1 , wherein material of said thermal pad comprises metal.
5. The structure of claim 1 , wherein material of said reflecting layer comprises metal or alloy.
6. A LED chip structure, comprising:
a substrate and a first type semiconductor layer disposed on said substrate;
a second type semiconductor layer disposed on said first type semiconductor layer;
a reflection layer formed on said second type semiconductor layer;
a passivation layer disposed on said reflection layer;
a first type semiconductor contact pad connected to said first type semiconductor layer, and a second type semiconductor contact pad connected to said second type semiconductor layer;
a thermal pad disposed on said passivation layer to conduct heat generated by said first type semiconductor layer and said second type semiconductor layer; and
solder bumps disposed on said first type semiconductor contact pad, said second type semiconductor contact pad and said thermal pad.
7. The structure of claim 6 , wherein said solder bumps contact a plurality of contact pads on an external substrate.
8. The structure of claim 7 , wherein material of said external substrate comprises white BT (bismaleimide triazine).
9. The structure of claim 7 , wherein said external substrate surrounds said LED chip structure.