Method for forming semiconductor device package with slanting structures

1. A method for forming semiconductor device package, comprising

providing a substrate with via contact pads and via through holes through said substrate, terminal pads on a bottom surface of said substrate and an exposed type through hole through said substrate,

wherein said exposed type through hole was filled with a second refilling material for forming a contact structure;

providing a die having bonding pads thereon and a thermal contact pad on a bottom surface of said die, wherein said thermal contact pad is aligned with said exposed type through hole, wherein said die is formed on a top surface of said substrate, and said thermal contact pad is formed between a backside surface of said die and a top surface of said contact structure, said second refilling material conducts heat generated by said die for reducing a thermal resistance;

wherein forming said die on the top surface of said substrate comprises:

forming a reflective layer on an upper surface of said substrate;

adhering said die directly on a top surface of said reflective layer and the top surface of said contact structure:

forming a film on a top of said die under a vacuum in a range of 1 E-1 to 1 E-2 Torr and a temperature in a range of 70 to 110 degree centigrade, said film flowing to an edge of said die to fill out a slope area adjacent to said die to form a slanting structure; and

forming a re-distribution layer conductive trace by sputtering and Electrolyte-plating on an upper surface of said slanting structure to offer path between said bonding pads of said die and said via contact pads of said substrate,

wherein said slanting structure is in direct contact with sidewalls of said die, said thermal contact pad, the top surface of said reflective layer, and said via contact pads of said substrate.

2. The method of claim 1 , further comprising filling a first refilling material within said via through holes to form conductive through holes, wherein said conductive through holes are electrically coupled to said via contact pads and said terminal pads on said substrate.

3. The method of claim 1 , wherein said second refilling material comprises aluminum, titanium, copper, nickel, silver or the combination thereof.

4. The method of claim 1 , further comprising forming a second contact pad on a backside surface of said contact structure.

5. The method of claim 1 , further comprising forming a dielectric layer on an upper surface of said die.

6. The method of claim 5 , further comprising forming a cover layer on said dielectric layer, said conductive trace, said via contact pads and said substrate.

7. The method of claim 5 , further comprising forming a lens with phosphor structure on said dielectric layer, said conductive trace, said via contact pads and said substrate.

8. The method of claim 1 , wherein material of said substrate comprises metal, glass, ceramic, silicon, plastic, bismaleimide triazine, FR4, FR5 or polyimide.

9. The method of claim 1 , wherein said reflective layer includes organic film, metal or alloy.

10. The method of claim 1 , wherein said reflective layer comprises Ag, Al or Au.

11. The method of claim 1 , wherein said forming a reflective layer on an upper surface of said substrate is performed by a sputtering process or coating an organic film.

12. The method of claim 1 , wherein a material of said re-distribution layer conductive trace comprises Cu/Ni/Au.