Patent Assignment
Reel/Frame 051909/0181
Assignment of Assignor's Interest
Recorded: 2020-02-24
Pages: 3
Assignor
KING DRAGON INTERNATIONAL INC.
Executed: 2020-02-12
Assignee
YANG, CHING-LUNG
1272 SUNRISE WAY, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Substrate Structure with Die Embedded Inside and Dual Build-Up Layers Over Both Side Surfaces and Method of the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 7, 2011
From: YANG, WEN-KUN
To: KING DRAGON INTERNATIONAL INC.
Reel/Frame 026552/0965 →
Assignment of Assignor's Interest
Jan 11, 2024
From: YANG, CHING-LUNG
To: YANG, WEN-KUN
Reel/Frame 066099/0117 →
Assignment of Assignor's Interest
Dec 1, 2024
From: YANG, WEN-KUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Reel/Frame 069442/0676 →