Patent Assignment
Reel/Frame 026344/0017
Assignment of Assignor's Interest
Recorded: 2011-05-26
Pages: 2
Assignors
CHO, YANG-SIK
Executed: 2011-05-18
HONG, SUNG-TAIK
Executed: 2011-05-18
WANG, GUN-HO
Executed: 2011-05-18
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Device-Embedded Flexible Printed Circuit Board and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.