Patent Assignment
Reel/Frame 026357/0608
Change of Name
Recorded: 2011-05-27
Pages: 3
Assignor
UTMC MICROELECTRONIC SYSTEMS INC.
Executed: 2000-05-01
Assignee
AEROFLEX UTMC MICROELECTRONIC SYSTEMS INC.
4350 CENTENNIAL BLVD., COLORADO SPRINGS, COLORADO, 80907
Covered Properties
(22)
Field Oxide Termination and Gate Oxide
Patent:
5,218,214 →
Application:
07/950,335 →
Mil-Std-1553 Interface Device Having a Bus Controller Minor Frame Timer
Patent:
5,367,641 →
Application:
07/971,434 →
Gate Array Architecture and Layout for Deep Space Applications
Patent:
5,543,736 →
Application:
08/165,236 →
Method of Fabricating an Isolation Trench for Analog Bipolar Devices in Harsh Environments
Patent:
5,561,073 →
Application:
08/226,804 →
Mil-Std-1553 Interface Device Having Autonomous Operation in All Modes
Patent:
5,490,254 →
Application:
08/232,851 →
Method of Making Bipolar Transistor Having Amorphous Silicon Contact as Emitter Diffusion Source
Patent:
5,670,394 →
Application:
08/317,155 →
Method of Enhancing the Current Gain of Bipolar Junction Transistors
Patent:
5,565,370 →
Application:
08/385,005 →
A Method of Making a Low Voltace Coefficient Capacitor
Patent:
5,525,533 →
Application:
08/385,522 →
Antifuse Structure and Process for Manufacturing the Same
Patent:
5,658,819 →
Application:
08/551,387 →
Method of Making an Antifuse Structure Using a Metal Caplayer
Patent:
5,759,876 →
Application:
08/551,588 →
High Reliability Logic Circuit for a Radiation Environment
Patent:
5,870,332 →
Application:
08/635,794 →
Bent Lead Repair Tool for Electronic Components
Patent:
5,778,947 →
Application:
08/854,263 →
Content Addressable Memory (Cam) Engine
Patent:
6,226,710 →
Application:
08/970,718 →
Method of Eliminating Buried Contact Resistance in Integrated Circuits
Patent:
6,008,125 →
Application:
08/990,175 →
Voltage Controlled Resistance Modulation for Single Event Upset Immunity
Patent:
6,271,568 →
Application:
08/999,346 →
Method for Making Recessed Field Oxide for Radiation Hardened Microelectronics
Patent:
6,063,690 →
Application:
08/999,476 →
Soi Combination Body Tie
Patent:
5,811,855 →
Application:
08/999,491 →
Multi-Level Interconnect Metallization Technique
Patent:
6,069,078 →
Application:
09/001,130 →
'Icb Method of Forming High Refractive Index Films"
Patent:
6,022,598 →
Application:
09/061,624 →
Method of Programmability and an Architecture for Cold Sparing of Cmos Arrays
Patent:
6,414,360 →
Application:
09/094,344 →
Raised Pedestal Radiation Shield for Sensitve Electronics
Patent:
6,121,672 →
Application:
09/185,162 →
Parameter Adjustment in a Mos Integrated Circuit
Patent:
6,346,427 →
Application:
09/376,246 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Intellectual Property Collateral
May 9, 2011
From: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
To: AEROFLEX COLORADO SPRINGS, INC., AS SUCCESSOR OF INTEREST TO UTMC MICROELECTRONIC SYSTEMS INC.
Reel/Frame 026247/0189 →
Change of Name
May 27, 2011
From: AEROFLEX UTMC MICROELECTRONIC SYSTEMS INC.
To: AEROFLEX COLORADO SPRINGS, INC.
Reel/Frame 026357/0804 →
Security Agreement
Jun 10, 2011
From: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, NA, AS COLLATERAL AGENT
Reel/Frame 026422/0719 →
Release of Patent Security Interest
Sep 12, 2014
From: JPMRGAN CHASE BANK, N.A.
To: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
Reel/Frame 033728/0942 →