IP Library › Assignment 026247/0189
Patent Assignment
Reel/Frame 026247/0189

Release of Security Interest in Intellectual Property Collateral

Recorded: 2011-05-09 Pages: 24
Assignor
Assignee
Covered Properties (35)
Variable Pitch Ic Bond Pad Arrangement
Patent: 4,753,820 →
Application: 06/920,632 →
Integrated Circuit Remote Terminal Stores Interface for Communication Between Cpu and Serial Bus
Patent: 5,012,404 →
Application: 07/263,748 →
Gate Output Driver Using Slew-Rate Control
Patent: 5,010,256 →
Application: 07/313,193 →
Trench Isolation Process
Patent: 5,206,182 →
Application: 07/363,000 →
Radiation Resistant Sram Memory Cell
Patent: 5,157,625 →
Application: 07/526,758 →
Thin Polysilicon Resistors
Patent: 5,141,597 →
Application: 07/613,333 →
Sram Memory Cell
Patent: 5,166,902 →
Application: 07/670,557 →
Preimplanted N-Channel Soi Mesa
Patent: 5,104,818 →
Application: 07/684,744 →
Silicon Mesa Transistor Structure
Patent: 5,128,733 →
Application: 07/701,738 →
Field Oxide Termination and Gate Oxide Formation
Patent: 5,187,113 →
Application: 07/701,739 →
Method of Making Soi Circuit with Buried Connectors
Patent: 5,145,802 →
Application: 07/790,796 →
Floating Voltage Reference
Patent: 5,146,151 →
Application: 07/844,906 →
Field Oxide Termination and Gate Oxide
Patent: 5,218,214 →
Application: 07/950,335 →
Gate Array Architecture and Layout for Deep Space Applications
Patent: 5,543,736 →
Application: 08/165,236 →
Method of Fabricating an Isolation Trench for Analog Bipolar Devices in Harsh Environments
Patent: 5,561,073 →
Application: 08/226,804 →
Mil-Std-1553 Interface Device Having Autonomous Operation in All Modes
Patent: 5,490,254 →
Application: 08/232,851 →
Method of Making Bipolar Transistor Having Amorphous Silicon Contact as Emitter Diffusion Source
Patent: 5,670,394 →
Application: 08/317,155 →
Method of Enhancing the Current Gain of Bipolar Junction Transistors
Patent: 5,565,370 →
Application: 08/385,005 →
A Method of Making a Low Voltace Coefficient Capacitor
Patent: 5,525,533 →
Application: 08/385,522 →
Antifuse Structure and Process for Manufacturing the Same
Patent: 5,658,819 →
Application: 08/551,387 →
Method of Making an Antifuse Structure Using a Metal Caplayer
Patent: 5,759,876 →
Application: 08/551,588 →
High Reliability Logic Circuit for a Radiation Environment
Patent: 5,870,332 →
Application: 08/635,794 →
Bent Lead Repair Tool for Electronic Components
Patent: 5,778,947 →
Application: 08/854,263 →
Content Addressable Memory (Cam) Engine
Patent: 6,226,710 →
Application: 08/970,718 →
Method of Eliminating Buried Contact Resistance in Integrated Circuits
Patent: 6,008,125 →
Application: 08/990,175 →
Voltage Controlled Resistance Modulation for Single Event Upset Immunity
Patent: 6,271,568 →
Application: 08/999,346 →
Method for Making Recessed Field Oxide for Radiation Hardened Microelectronics
Patent: 6,063,690 →
Application: 08/999,476 →
Soi Combination Body Tie
Patent: 5,811,855 →
Application: 08/999,491 →
Multi-Level Interconnect Metallization Technique
Patent: 6,069,078 →
Application: 09/001,130 →
'Icb Method of Forming High Refractive Index Films"
Patent: 6,022,598 →
Application: 09/061,624 →
Radiation Hardened Semiconductor Device
Patent: 6,511,893 →
Application: 09/072,932 →
Method of Programmability and an Architecture for Cold Sparing of Cmos Arrays
Patent: 6,414,360 →
Application: 09/094,344 →
Raised Pedestal Radiation Shield for Sensitve Electronics
Patent: 6,121,672 →
Application: 09/185,162 →
Apparatus and Method to Determine a Longest Prefix Match in a Content Addressable Memory
Patent: 6,353,873 →
Application: 09/243,041 →
Parameter Adjustment in a Mos Integrated Circuit
Patent: 6,346,427 →
Application: 09/376,246 →
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Agreement Sep 17, 2007
From: AEROFLEX COLORADO SPRINGS, INC., AS SUCCESSOR OF INTEREST TO UTMC MICROELECTRONIC SYSTEMS INC.
To: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
Reel/Frame 019834/0419 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 007261 Frame 0411. Assignor(S) Hereby Confirms the the Name of Ozer M. N. Teitelbaum Was Listed in Error. Apr 13, 2010
From: JEROME, RICK C.; POST, IAN R. C.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 024225/0257 →
Change of Name May 27, 2011
From: UTMC MICROELECTRONIC SYSTEMS INC.
To: AEROFLEX UTMC MICROELECTRONIC SYSTEMS INC.
Reel/Frame 026357/0608 →
Change of Name May 27, 2011
From: AEROFLEX UTMC MICROELECTRONIC SYSTEMS INC.
To: AEROFLEX COLORADO SPRINGS, INC.
Reel/Frame 026357/0804 →
Security Agreement Jun 10, 2011
From: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, NA, AS COLLATERAL AGENT
Reel/Frame 026422/0719 →
Release of Patent Security Interest Sep 12, 2014
From: JPMRGAN CHASE BANK, N.A.
To: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
Reel/Frame 033728/0942 →