Patent Assignment
Reel/Frame 026524/0185
Assignment of Assignor's Interest
Recorded: 2011-06-29
Pages: 2
Assignor
LIN, YAOJIAN
Executed: 2011-06-28
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Wafer Level Package Integration
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →
Corrective Assignment to Correct the Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 38378 Frame: 427. Assignor(S) Hereby Confirms the Change of Name.
May 29, 2024
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 067534/0628 →