Patent Assignment
Reel/Frame 026601/0617
Assignment of Assignor's Interest
Recorded: 2011-07-15
Pages: 6
Assignors
KOO, JUN MO
Executed: 2011-07-08
MARIMUTHU, PANDI CHELVAM
Executed: 2011-07-08
KU, JAE HUN
Executed: 2011-07-08
YOON, SEUNG WOOK
Executed: 2011-07-08
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Tsv Interposer with Semiconductor Die and Build-Up Interconnect Structure on Opposing Surfaces of the Interposer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →