Patent Assignment
Reel/Frame 026605/0102
Assignment of Assignor's Interest
Recorded: 2011-07-18
Pages: 8
Assignors
YEW, TRI-RUNG
Executed: 2011-06-27
HUANG, YI-MIN
Executed: 2011-06-28
LUR, WATER
Executed: 2011-06-27
SUN, SHIH-WEI
Executed: 2011-06-27
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN 2ND ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Dual Damascene Structure for the Wiring-Line Structures of Multi-Level Interconnects in Integrated Circuit
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 25, 2011
From: UNITED MICROELECTRONICS CORP.
To: INTELLECTUAL VENTURES FUND 74 LLC
Reel/Frame 026645/0414 →
Merger
Jan 29, 2016
From: INTELLECTUAL VENTURES FUND 74 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037625/0564 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 1, 2020
From: INTELLECTUAL VENTURES HOLDING 81 LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0017 →