IP Library › Assignment 026645/0414
Patent Assignment
Reel/Frame 026645/0414

Assignment of Assignor's Interest

Recorded: 2011-07-25 Pages: 12
Assignor
UNITED MICROELECTRONICS CORP.
Executed: 2011-04-08
Assignee
INTELLECTUAL VENTURES FUND 74 LLC
7251 W LAKE MEAD BLVD, STE 300, LAS VEGAS, NEVADA, 89128
Covered Property (1)
Dual Damascene Structure for the Wiring-Line Structures of Multi-Level Interconnects in Integrated Circuit
Patent: 7,378,740 →
Application: 11/196,038 →
Publication: US 2005/0263876
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 18, 2011
From: YEW, TRI-RUNG; HUANG, YI-MIN; LUR, WATER; SUN, SHIH-WEI
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 026605/0102 →
Merger Jan 29, 2016
From: INTELLECTUAL VENTURES FUND 74 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037625/0564 →
Assignment of Assignor's Interest Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest Feb 1, 2020
From: INTELLECTUAL VENTURES HOLDING 81 LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0017 →