Patent Assignment
Reel/Frame 026824/0053
Assignment of Assignor's Interest
Recorded: 2011-08-29
Pages: 2
Assignor
MADURAWE, RAMINDA U.
Executed: 2011-05-20
Assignee
TIER LOGIC INC.
P.O. BOX 2760, CUPERTINO, CALIFORNIA, 95015
Covered Property
(1)
Pads and Pin-Outs in Three Dimensional Integrated Circuits
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 31, 2011
From: TIER LOGIC, INC.
To: YAKIMISHU CO. LTD., LLC
Reel/Frame 026839/0396 →
Merger
Oct 9, 2015
From: YAKIMISHU CO. LTD., L.L.C.
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 036829/0821 →
Assignment of Assignor's Interest
Jan 3, 2020
From: CALLAHAN CELLULAR L.L.C.
To: INTELLECTUAL VENTURES ASSETS 154 LLC
Reel/Frame 051464/0389 →
Assignment of Assignor's Interest
Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 154 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051709/0805 →
Patent Security Agreement
May 1, 2023
From: RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 063503/0742 →
Release of Lien on Patents
Aug 5, 2024
From: BARINGS FINANCE LLC
To: RPX CORPORATION
Reel/Frame 068328/0278 →
Patent Security Agreement
Aug 6, 2024
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 068328/0674 →