Patent Assignment
Reel/Frame 026857/0732
Assignment of Assignor's Interest
Recorded: 2011-09-06
Pages: 4
Assignors
PAGAILA, REZA A.
Executed: 2011-08-24
DO, BYUNG TAI
Executed: 2011-08-24
CHUA, LINDA PEI EE
Executed: 2011-08-24
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor device and method of forming FO-WLCSP with recessed interconnect area in peripheral region of semiconductor die
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0418 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053511/0298 →
Corrective Assignment to Correct the Assignee's Name on Coversheet from "Stats Chippac Pte. Lte." to "Stats Chippac Pte. Ltd." Previously Recorded on Reel 038378 Frame 0418. Assignor(S) Hereby Confirms the Change of Name.
Sep 5, 2023
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 064908/0920 →