Patent Assignment
Reel/Frame 027022/0774
Assignment of Assignor's Interest
Recorded: 2011-10-06
Pages: 4
Assignors
CHERN, CHYI SHYUAN
Executed: 2011-09-30
WU, HSIN-HSIEN
Executed: 2011-09-30
YU, CHIH-KUANG
Executed: 2011-09-30
KUO, HUNG-YI
Executed: 2011-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for Accurate Die-to-Wafer Bonding
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027919/0247 →
Merger
Dec 8, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037508/0093 →
Change of Name
Dec 8, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037508/0131 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →