Patent Assignment
Reel/Frame 027919/0247
Assignment of Assignor's Interest
Recorded: 2012-03-23
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Method and Apparatus for Accurate Die-to-Wafer Bonding
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 6, 2011
From: CHERN, CHYI SHYUAN; WU, HSIN-HSIEN; YU, CHIH-KUANG; KUO, HUNG-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 027022/0774 →
Merger
Dec 8, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037508/0093 →
Change of Name
Dec 8, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037508/0131 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →