Patent Assignment
Reel/Frame 027037/0070
Assignment of Assignor's Interest
Recorded: 2011-10-10
Pages: 3
Assignors
DAS, RABINDRA N.
Executed: 2011-07-19
PAPATHOMAS, KONSTANTINOS I.
Executed: 2011-07-19
MARKOVICH, VOYA R.
Executed: 2011-07-19
MCNAMARA, JAMES J., JR.
Executed: 2011-07-19
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Circuitized Substrate with Low Loss Capacitive Material and Method of Making Same
Patent:
8,446,707 →
Application:
13/269,770 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Security Agreement
May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement
Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest
Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest
Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
Security Interest
Nov 14, 2016
From: I3 ELECTRONICS, INC.
To: M&T BANK
Reel/Frame 040608/0626 →
Assignment of Assignor's Interest
Jul 15, 2019
From: I3 ELECTRONICS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 049758/0265 →