Circuitized substrate with low loss capacitive material and method of making same
View Patent ↗A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.
1. A temperature stable, frequency stable low loss capacitance and temperature stable, frequency stable low loss insulating dielectric material having non-flaking characteristics for use with electronic circuit boards, comprising:
a) thermosetting resin;
b) thermoplastic resin;
c) cross-linker;
d) ferroelectric ceramic particles comprising barium titanate; and
e) means for modifying the effective dielectric material thickness to provide impedance matching within a layer of substrate.
2. The material in accordance with claim 1 , wherein said thermosetting resin is selected from a group consisting of: modified poly(phenylene) ether (MPPE), epoxy resin, high temperature diglycidyl ether, polyimide, cyanate ester (triazines) and bismaleimide blends, triazine-bismaleimide and epoxy modified blend, benzoxazine, epoxy modified benzoxazine, halogen free benzoxazine, fluoropolymer, benzocyclobutene, perfluorobutane, polyphenylenesulfide, polysulfone, polyetherimide, polyetherketone, polyphenylquinoxaline, polybenzoxazole, polyphenyl benzobisthiazole and combinations thereof.
3. The material in accordance with claim 2 , wherein said thermosetting resin comprises an amount of approximately 5% to approximately 90% by weight of said material.
4. The material in accordance with claim 1 , wherein said thermoplastic resin is selected from a group consisting of: polyolefins such as polypropylene, polysulfones, polycarbonates, nitrile rubbers, polymers based on second generation styrenic block copolymers with a hydrogenated midblock of styrene-ethylene/butylene-styrene (SEBS) or styrene-ethylene/propylene-styrene (SEPS), ABS polymers, and fluorocarbon polymers such as polytetrafluoroethylene, polymers of chlorotrifluoroethylene, fluorinated ethylenepropylene polymers, polyvinylidene fluoride and polyhexafluoropropylene and combinations thereof.
5. The material in accordance with claim 4 , wherein said thermoplastic resin comprises an amount of approximately 5% to approximately 50% by weight of said material.
6. The material in accordance with claim 1 , wherein said cross linker is selected from a group consisting of: at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate and combinations thereof.
7. The material in accordance with claim 6 , wherein said cross linker comprises an amount of approximately 2% to approximately 65% by weight of said material.
8. The material in accordance with claim 1 , wherein said ferroelectric ceramic is selected from a group consisting of: barium titanate, substituted barium titanate, strontium titanate, lead titanate, lead zirconate titanate, substituted lead zirconate titanate, solid solutions of lead magnesium niobate and lead titanate, solid solutions of lead zinc niobate and lead titanate, lead iron tantalite, other ferroelectric tantalates, and combinations or mixtures thereof.
9. The material in accordance with claim 8 , wherein said ferroelectric ceramic comprises an amount of approximately 40% to approximately 75% by weight of said material.
10. The material in accordance with claim 8 , wherein said ferroelectric ceramic particles comprises nanoparticles.
11. The temperature stable, frequency stable low loss capacitance and temperature stable, frequency stable low loss insulating dielectric material having non-flaking characteristics for use with electronic circuit boards in accordance with claim 1 , wherein said means modifying the effective dielectric material thickness to provide impedance matching within a layer of substrate comprises at least one internal capacitor formed in said layer.