IP Library › Assignment 027118/0680
Patent Assignment
Reel/Frame 027118/0680

Merger

Recorded: 2011-10-25 Pages: 8
Assignor
SOUTH EPITAXY CORPORATION
Executed: 2005-08-01
Assignee
EPITECH TECHNOLOGY CORPORATION
NO. 16, DA-SHUN 9TH RD., HSIN-SHUN HSIANG, TAINAN SCIENCE-BASED INDUSTRIAL PARK, TAINAN COUNTY, 744, TAIWAN
Covered Properties (3)
Bumping Process of Light Emitting Diode
Patent: 7,358,173 →
Application: 10/711,280 →
Publication: US 2005/0176231
Light-Emitting Diode Structure with Electrostatic Discharge Protection
Patent: 7,151,281 →
Application: 10/711,531 →
Publication: US 2005/0167680
Light-Emitting Diode Package Structure
Patent: 7,482,696 →
Application: 10/826,003 →
Publication: US 2005/0127485
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 16, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015230/0933 →
Assignment of Assignor's Interest Sep 7, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015086/0961 →
Assignment of Assignor's Interest Sep 24, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015168/0735 →
Merger Oct 25, 2011
From: EPITECH TECHNOLOGY CORPORATION
To: EPISTAR CORPORATION
Reel/Frame 027118/0696 →