Patent Assignment
Reel/Frame 027118/0696
Merger
Recorded: 2011-10-25
Pages: 9
Assignor
EPITECH TECHNOLOGY CORPORATION
Executed: 2007-03-01
Assignee
EPISTAR CORPORATION
NO. 5, LI-HSIN 5TH RD., HSIN-CHU SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Properties
(4)
[Flip Chip Light-Emitting Diode Package]
Bumping Process of Light Emitting Diode
Light-Emitting Diode Structure with Electrostatic Discharge Protection
Light-Emitting Diode Package Structure
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 16, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015230/0933 →
Assignment of Assignor's Interest
Jul 9, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 014828/0911 →
Assignment of Assignor's Interest
Sep 7, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015086/0961 →
Assignment of Assignor's Interest
Sep 24, 2004
From: SHEI, SHIH-CHANG; SHEU, JINN-KONG
To: SOUTH EPITAXY CORPORATION
Reel/Frame 015168/0735 →
Assignment of Assignor's Interest
Aug 2, 2006
From: SOUTH EPITAXY CORPORATION
To: EPITECH TECHNOLOGY CORPORATION
Reel/Frame 018043/0792 →
Merger
Oct 25, 2011
From: SOUTH EPITAXY CORPORATION
To: EPITECH TECHNOLOGY CORPORATION
Reel/Frame 027118/0680 →