Patent Assignment
Reel/Frame 027125/0363
Assignment of Assignor's Interest
Recorded: 2011-10-26
Pages: 5
Assignors
FULLER, NICHOLAS C.M.
Executed: 2011-10-21
JOSEPH, ERIC A.
Executed: 2011-10-21
SIKORSKI, EDMUND M.
Executed: 2011-10-24
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
High Aspect Ratio and Reduced Undercut Trench Etch Process for a Semiconductor Substrate
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 26, 2011
From: MATSUURA, GOH
To: ZEON CORPORATION
Reel/Frame 027125/0368 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Assignment of Assignor's Interest
Nov 19, 2020
From: GLOBALFOUNDRIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 054482/0862 →
Release of Security Interest
Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054479/0842 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →