Patent Assignment
Reel/Frame 027174/0540
Assignment of Assignor's Interest
Recorded: 2011-11-02
Pages: 2
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1-, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO 103-8338, JAPAN
Covered Property
(1)
Adhesive Sheet and Method of Backgrinding Semiconductor Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.