Change of Name

Recorded: 2015-11-30 Pages: 22

Assignor

Executed: 2015-10-01

Assignee

DENKA COMPANY LIMITED

1-1, NIHONBASHI-MUROMACHI 2-CHOME,, CHUO-KU, TOKYO, 103-8338, JAPAN

Covered Property (1)

Adhesive Sheet and Method of Backgrinding Semiconductor Wafer

Patent: 9,267,059 →

Application: 13/318,436 →

Publication: US 2012/0052772

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.