IP Library Assignment 027203/0058
Patent Assignment
Reel/Frame 027203/0058

Assignment of Assignor's Interest

Recorded: 2011-11-09 Pages: 3
Assignors
HAMAMOTO, MITCHELL M.
Executed: 2006-04-11
GAO, CHEN YI
Executed: 2006-04-11
HWEE, TAN KIM
Executed: 2006-04-11
Assignee
CALIFORNIA MICRO DEVICES
490 MCCARTHY BOULEVARD, SUITE 100, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Device Having Wire Bond and Redistribution Layer
Patent: 8,058,712 →
Application: 12/861,744 →
Publication: US 2011/0204495
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Nov 9, 2011
From: CALIFORNIA MICRO DEVICES CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 027203/0112 →
Security Interest Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
Corrective Assignment to Correct the Incorrect Patent Number 5859768 and to Recite Collateral Agent Role of Receiving Party in the Security Interest Previously Recorded on Reel 038620 Frame 0087. Assignor(S) Hereby Confirms the Security Interest. Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
Release of Security Interest in Patents Recorded at Reel 038620, Frame 0087 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →