Patent Assignment
Reel/Frame 027260/0922
Assignment of Assignor's Interest
Recorded: 2011-11-18
Pages: 6
Assignors
HUANG, RUI
Executed: 2011-09-19
BAO, XUSHENG
Executed: 2011-09-19
CHEN, KANG
Executed: 2011-09-23
HSIAO, YUNG KUAN
Executed: 2011-09-23
GOH, HIN HWA
Executed: 2011-09-23
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with a Substrate Embedded Dummy-Die Paddle and Method of Manufacture Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039428/0928 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →