Patent Assignment
Reel/Frame 027329/0257
Assignment of Assignor's Interest
Recorded: 2011-12-06
Pages: 10
Assignors
YEONG, SAI HOOI
Executed: 2011-12-02
WANG, TAO
Executed: 2011-12-02
PANDEY, SHESH MANI
Executed: 2011-11-25
YEO, CHIA CHING
Executed: 2011-12-06
LEUNG, YING KEUNG
Executed: 2011-12-02
QUEK, ELGIN KIOK BOONE
Executed: 2011-12-02
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property
(1)
Method for Fabricating Semiconductor Devices Using Stress Engineering
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 2, 2019
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049669/0775 →
Assignment of Assignor's Interest
Jul 16, 2020
From: ALSEPHINA INNOVATIONS, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 053351/0839 →
Release of Security Interest
Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →