Patent Assignment
Reel/Frame 027335/0760
Assignment of Assignor's Interest
Recorded: 2011-12-07
Pages: 4
Assignor
JAKOB + RICHTER IP-VERWERTUNGSGESELLSCHAFT MBH
Executed: 2011-11-20
Assignee
THIN MATERIALS AG
ELSTERSTRASSE 23, EICHENAU, 82223, GERMANY
Covered Property
(1)
Method for Processing, in Particular, Thin Rear Sides of a Wafer, Wafer-Carrier Arrangement and Method for Producing Said Type of Wafer-Carrier Arrangement
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.