IP Library Assignment 027344/0042
Patent Assignment
Reel/Frame 027344/0042

Assignment of Assignor's Interest

Recorded: 2011-12-06 Pages: 4
Assignor
JAKOB, ANDREAS
Executed: 2008-09-19
Assignee
JAKOB + RICHTER IP-VERWERTUNGSGESELLCHAFT MBH
ELSTERSTRASSE 23, EICHENAU, 82223, GERMANY
Covered Property (1)
Method for Processing, in Particular, Thin Rear Sides of a Wafer, Wafer-Carrier Arrangement and Method for Producing Said Type of Wafer-Carrier Arrangement
Patent: 8,911,583 →
Application: 12/280,758 →
Publication: US 2010/0043608
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 7, 2011
From: JAKOB + RICHTER IP-VERWERTUNGSGESELLSCHAFT MBH
To: THIN MATERIALS AG
Reel/Frame 027335/0760 →
Nunc Pro Tunc Assignment May 25, 2017
From: THIN MATERIALS GMBH
To: NISSAN CHEMICAL INDUSTRIES, LTD.
Reel/Frame 042505/0274 →