Patent Assignment
Reel/Frame 027477/0336
Assignment of Assignor's Interest
Recorded: 2012-01-04
Pages: 2
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Circuit Board and Circuit Board Manufactured by the Method
Application:
13/343,347 →
Publication:
US 2012/0292092
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.