Patent Assignment
Reel/Frame 027508/0672
Assignment of Assignor's Interest
Recorded: 2012-01-10
Pages: 3
Assignors
MEYER, THORSTEN
Executed: 2012-01-10
OFNER, GERALD
Executed: 2012-01-10
WAIDHAS, BERND
Executed: 2012-01-10
Assignee
INTEL MOBILE COMMUNICATIONS GMBH
AM CAMPEON 10-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Enhanced Flip Chip Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest
Nov 12, 2020
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 054344/0672 →
Assignment of Assignor's Interest
Dec 16, 2020
From: INTEL CORPORATION
To: GOOGLE LLC
Reel/Frame 054772/0918 →