IP Library › Assignment 054344/0672
Patent Assignment
Reel/Frame 054344/0672

Assignment of Assignor's Interest

Recorded: 2020-11-12 Pages: 7
Assignor
INTEL DEUTSCHLAND GMBH
Executed: 2020-11-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (4)
Enhanced Flip Chip Package
Patent: 8,716,859 →
Application: 13/346,993 →
Publication: US 2013/0175686
Chip Arrangements
Patent: 8,907,480 →
Application: 13/802,848 →
Publication: US 2014/0264832
Enhanced Flip Chip Package
Patent: 9,059,304 →
Application: 14/164,289 →
Publication: US 2014/0138827
Semiconductor Devices
Patent: 9,385,105 →
Application: 14/370,971 →
Publication: US 2015/0028478
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2012
From: MEYER, THORSTEN; OFNER, GERALD; WAIDHAS, BERND
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 027508/0672 →
Assignment of Assignor's Interest Apr 24, 2013
From: MEYER, THORSTEN; BARTH, HANS-JOACHIM; MAHNKOPF, REINHARD; ALBERS, SVEN
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 030273/0544 →
Change of Name Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest Dec 16, 2020
From: INTEL CORPORATION
To: GOOGLE LLC
Reel/Frame 054772/0918 →