IP Library › Assignment 027816/0403
Patent Assignment
Reel/Frame 027816/0403

Assignment of Assignor's Interest

Recorded: 2012-01-25 Pages: 3
Assignors
NEMOTO, SHUSEI
Executed: 2012-01-10
MASHIYAMA, HISASHI
Executed: 2012-01-10
Assignee
HITACHI CABLE, LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Wafer and Semiconductor Device Wafer
Patent: 8,796,820 →
Application: 13/356,799 →
Publication: US 2012/0187547
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Feb 15, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032268/0297 →
Company Split Jul 24, 2015
From: HITACHI METALS, LTD.
To: SCIOCS COMPANY LIMITED
Reel/Frame 036181/0104 →
Assignment of Assignor's Interest Feb 16, 2016
From: SCIOCS COMPANY LIMITED
To: SUMITOMO CHEMICAL COMPANY, LIMITED
Reel/Frame 037827/0453 →