Patent Assignment
Reel/Frame 027855/0937
Assignment of Assignor's Interest
Recorded: 2012-03-13
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Reflective Layer Between Light-Emitting Diodes
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 13, 2008
From: CHEN, DING-YUAN; YU, CHIA-LIN; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021831/0556 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →