IP Library › Assignment 028025/0575
Patent Assignment
Reel/Frame 028025/0575

Assignment of Assignor's Interest

Recorded: 2012-04-11 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Fabrication of Compact Opto-Electronic Component Packages
Patent: 7,851,818 →
Application: 12/236,182 →
Publication: US 2009/0321760
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2008
From: KUHMANN, JOCHEN
To: HYMITE A/S
Reel/Frame 021945/0313 →
Assignment of Assignor's Interest Nov 30, 2010
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025403/0566 →
Merger Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037196/0816 →
Change of Name Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037211/0130 →