IP Library › Assignment 028142/0283
Patent Assignment
Reel/Frame 028142/0283

Assignment of Assignor's Interest

Recorded: 2012-05-02 Pages: 3
Assignors
LIN, HOW
Executed: 2010-07-09
EGITTO, FRANK
Executed: 2010-07-08
MARKOVICH, VOYA
Executed: 2010-07-08
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property (1)
Semi-Conductor Chip with Compressible Contact Structure and Electronic Package Utilizing Same
Patent: 8,198,739 →
Application: 12/836,612 →
Publication: US 2012/0038046
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Release of Security Interest Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →
Security Interest Nov 14, 2016
From: I3 ELECTRONICS, INC.
To: M&T BANK
Reel/Frame 040608/0626 →
Assignment of Assignor's Interest Jul 15, 2019
From: I3 ELECTRONICS, INC.
To: TTM TECHNOLOGIES NORTH AMERICA, LLC
Reel/Frame 049758/0265 →