Patent Assignment
Reel/Frame 028221/0049
Assignment of Assignor's Interest
Recorded: 2012-05-16
Pages: 2
Assignors
MINAMI, HISATAKA
Executed: 2012-04-20
AMANOKURA, JIN
Executed: 2012-04-23
ANZAI, SOU
Executed: 2012-04-23
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Cmp Polishing Solution and Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Aug 28, 2017
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 043687/0600 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →