IP Library Assignment 043687/0600
Patent Assignment
Reel/Frame 043687/0600

Change of Address

Recorded: 2017-08-28 Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Property (1)
Cmp Polishing Solution and Polishing Method
Patent: 9,799,532 →
Application: 13/510,273 →
Publication: US 2012/0238094
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 16, 2012
From: MINAMI, HISATAKA; AMANOKURA, JIN; ANZAI, SOU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 028221/0049 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →