IP Library › Assignment 028421/0064
Patent Assignment
Reel/Frame 028421/0064

Assignment of Assignor's Interest

Recorded: 2012-06-21 Pages: 4
Assignors
PITNEY, JOHN ALLEN
Executed: 2012-05-14
HAMANO, MANABU
Executed: 2012-06-12
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property (1)
Methods for Fabricating a Semiconductor Wafer Processing Device
Patent: 8,940,094 →
Application: 13/443,076 →
Publication: US 2013/0263776
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Assignment of Assignor's Interest May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
Notice of License Agreement Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
Assignment of Assignor's Interest Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →