Methods for fabricating a semiconductor wafer processing device
View Patent ↗A method of fabricating a semiconductor processing device includes providing a susceptor including a substantially cylindrical body portion having opposing upper and lower surfaces. The body portion has a diameter larger than a wafer diameter. The method also includes providing a set of holes circumferentially disposed at a first susceptor diameter, the set of holes being evenly spaced with respect to adjacent holes and extending through the upper and lower surfaces in an area. The first susceptor diameter is larger than the wafer diameter, and holes are omitted along the first diameter in a set of predetermined orientations.
1. A method of treating a wafer in an epitaxial chemical vapor deposition process, the method comprising:
providing a susceptor having a plurality of holes circumferentially disposed at a first susceptor diameter, wherein the first susceptor diameter is larger than a diameter of a wafer to be treated;
placing the untreated wafer on the susceptor in a predetermined orientation such that <110> directions of the wafer aligns with portions of the susceptor that are free of holes outward from the diameter of the untreated wafer; and
chemically treating the wafer.
2. The method according to claim 1 , wherein the diameter of the wafer is a first diameter, the method further comprising measuring a delta edge roll off at a second diameter of the wafer.
3. The method according to claim 1 , wherein placing the untreated wafer on the susceptor comprises placing the wafer on the susceptor such that no holes are outside the wafer diameter at locations of approximately plus-or-minus 9 degrees of the <110> directions of the wafer.
4. The method according to claim 1 , wherein placing the untreated wafer on the susceptor comprises placing the wafer on the susceptor such that no holes are outside the wafer diameter at locations of approximately plus-or-minus 10 degrees of the <110> directions of the wafer.
5. The method according to claim 1 , wherein providing the susceptor includes providing the plurality of holes in groups, each of the groups being disposed at 90 degree intervals to an adjacent group.
6. The method according to claim 1 , wherein providing the susceptor includes providing the plurality of holes with a spacing between each hole of between about 1 degree and about 4 degrees.
7. The method according to claim 1 , wherein the wafer diameter is between about 150 mm and about 300 mm.
8. The method according to claim 1 , wherein each hole has a diameter of between about 0.8 mm and about 1.0 mm.
9. The method according to claim 1 , wherein providing the susceptor comprises providing the plurality of holes at a hole density that varies circumferentially around the first susceptor diameter.
10. The method according to claim 9 , wherein the hole density varies from between about 0.25 holes per degree to about 1.0 holes per degree.